Applicability of random sequential adsorption (RSA) model for the material removal during a surface plasma polishing is discussed. The mechanical nature of plasma polishing process is taken into consideration in modified version of RSA model. During the plasma polishing the surface layer is aligned such that molecules of material are removed from the surface mechanically as a consequence of the surface deformation induced by plasma particles impact. We propose modification of RSA technique to describe the reduction of material on the surface provided that sequential character of molecules release from the surface is maintained throughout the polishing process. This empirical model is able to estimate depth profile of material density on the surface during the plasma polishing. We have shown that preliminary results obtained from this model are in good agreement with experimental results. We believe that molecular dynamics simulation of the polishing process, possibly also other types of surface treatment, can be based on this model. However influence of material parameters and processing conditions (including plasma characteristics) must be taken into account using appropriate model variables. (c) 2015 Elsevier B.V. All rights reserved.