A composite coating composed of cupric oxide (CuO) and silicon-based resin was applied to an aluminum-alloy heat sink for a light emitting diode (LED) module. The purpose of the composite coating is to improve the heat dissipation performance of heat sink by enhancing thermal radiation emission. The heat dissipation performance was investigated in terms of LED junction temperature and thermal resistance using a thermal transient method. The CuO and silicon-based resin composite coating showed higher emissivity, and the lower junction temperature and thermal resistance of the heat sink was achieved. In addition, a continuous operation test of the LED chip with the heat sink revealed that the surface treated with the CuO composite coating stably dissipated heat without degradation. In conclusion, the composite coating proposed here showed a significant improvement of the heat dissipation performance of the aluminum-alloy heat sink due to the enhanced thermal radiation property. (C) 2015 Elsevier Ltd. All rights reserved.