화학공학소재연구정보센터
Journal of Materials Science, Vol.32, No.6, 1393-1397, 1997
Transient Liquid-Phase Bonding of Alumina and Metal-Matrix Composite Base Materials
Transient liquid-phase (TLP) bonding of aluminium-based metal matrix composite (MMC) and Al2O3 ceramic materials has been investigated, particularly the relationship between particle segregation, copper interlayer thickness, holding time and joint shear strength properties. The long completion time and the slow rate of movement of the solid-liquid interface during MMC/Al2O3 bonding markedly increased the likelihood of forming a particle-segregated layer at the dissimilar joint interface. Preferential failure occurred through the particle-segregated layer in dissimilar joints produced using 20 and 30 mu m thick copper foils and long holding times (greater than or equal to 20 min). When the particle-segregated layer was very thin (<10 mu m), joint failure was determined by the residual stress distribution in the Al2O3/MMC joints, not by preferential fracture through the particle-segregated layer located at the bondline. Satisfactory shear strength properties were obtained when a thin (5 mu m thick) copper foil was used during TLP bonding at 853 K.