The nature of film stresses in hot-filament chemical vapour deposited (HFCVD) diamond thin films on tungsten carbide substrates, is reported. Commercial WC substrates were subjected to various surface treatments. Subsequently, they were coated with a diamond film and examined for stresses using X-ray diffraction. All but one of the stress measurements indicated various levels of compressive stresses in the film and at the film-substrate interface. These stresses are compared with those obtained by other researchers. Intrinsic film stresses were also computed for diamond films and found to be tensile. WC drills, of 0.125 in. diameter, were also diamond coated and the stress levels measured along drill flanks and flutes. Significant variations were found in these stresses, and the results were analysed from a film-substrate adhesion perspective.