Zirconium diboride (ZrB2) thin films have been deposited on 4H-SiC(0001) substrates by direct current magnetron sputtering from a compound target. The effect of deposition temperature (500-900 degrees C) and sputtering power (100-400 W) on the composition and structure of the films have been investigated. Electron microscopy and X-ray diffraction reveal that high sputtering power values and high deposition temperatures are favorable to enhance the crystalline order of the epitaxial 0001 oriented films. X-ray photoelectron spectroscopy shows that the composition of the films is near-stoichiometric for all deposition temperatures and for high sputtering power values of 300 W and 400 W, whereas under-stoichiometric films arc obtained when applying 100 W or 200 W. Decreasing the deposition temperature, or in particular the sputtering power, result in higher C and O impurity levels. The resistivity of the films was evaluated by four-point-probe measurements and found to scale with the amount of O impurities in the films. The lowest resistivity value obtained is 130 mu Omega cm, which makes the ZrB2 films interesting as an electrical contact material. (C) 2015 Elsevier B.V. All rights reserved.