Adhesion experiments were performed using both morphological and surface chemical modifications to identify whether one is dominant in controlling copper-epoxy adhesion and durability. Surface preparation procedures included sanding and etching copper surfaces which were thermally oxidized and a surface plating treatment that formed oxidized nodules on the copper surface. Further surface chemical modification used benzotriazole primary and chromium ion implantation on copper oxide. All prepared surfaces were laminated to an epoxy-glass resin cloth and the interfaces were aged in an air oven at 150 degrees C. Adhesion with ageing time was measured by a floating roller peeler assembly attached to a mechanical load frame. Interfaces formed when copper was oxidized in air had significantly lower peel strength than interfaces prepared by the plating treatment. Furthermore, peel adhesion was significantly reduced by elevated temperature conditioning. Adhesion degradation kinetics were applied to the transitional peel adhesion data and kinetic parameters associated with degradation at 150 degrees C were calculated. The results suggest that peel failure for the thermally oxidized samples occurs within the oxide layer, and that surface treatments on the oxide layer are not effective in altering adhesion. The peel adhesion of the electroplated surfaces was affected by the surface chemistry. No difference was observed in the fracture surface as a function of chemistry or ageing time.