Random copolycyanurates with a low number of amide units in the main chain have been developed as a candidate of dismantlable adhesives based on the rapid decrease of the molecular weights during the rearrangement to polyisocyanurates by a thermal treatment. The random copolycyanurates were prepared by the phase-transfer-catalyzed polycondensation of 2,4-dichloro-6-methoxy-1,3,5-triazine with bisphenol A and a new bisphenol containing an amide unit in the presence of tetrabutylammonium bromide. They exhibited an excellent adhesive property for the silicon and copper deposited on the silicon substrate after the high thermal treatment of 240 degrees C under 0.6 MPa compression, and the die shear strengths of these polymers dramatically decreased at 260 degrees C for 1 h. Random copolycyanurates containing the amide unit are shown to be promising materials for dismantlable adhesion. (C) 2015 Wiley Periodicals, Inc.