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Particulate Science and Technology, Vol.33, No.1, 109-112, 2015
A Study on Microsized Titanium Oxide-Filled Epoxy with Enhanced Heat Conductivity for Microelectronic Applications
This article presents a study on the thermal conductivity characterization of microsized TiO2-filled epoxy composites. Titanium oxide (TiO2) particles of about 100 mu m mean size are embedded in epoxy resin to develop composites by hand layup technique. Effective thermal conductivity values of these samples are measured using Unitherm Model 2022 in accordance with ASTM-E 1530 standards. The measured values are then compared with those obtained from a mathematical correlation deduced basing upon a one-dimensional heat conduction model developed by the authors previously. This study reveals that there is a significant improvement in thermal conductivity of the composites with increase in TiO2 content. With addition of 25vol% of TiO2, the thermal conductivity of epoxy composite improves by about 223%. On comparing the measured conductivity values with those obtained from the theoretical model, it has been observed that the measured values are in very good agreement with the theoretical values for low filler concentrations (0-17.5vol%). It is further seen that TiO2 particles show percolation behavior in epoxy matrix at about 17.5vol% of filler content at which a sudden jump in the conductivity value is noticed.