A thermoplastic resin poly(bisphenol A-co-epichlorohydrin) (PBAE) is blended with a high glass transition temperature (T-g) epoxy matrix to serve as both a toughening additive and a healing agent in combination with an encapsulated solvent. Microcapsules are coated with poly(dopamine) (PDA) to improve the thermal stability and retain the core solvent during curing at 180 degrees C. The fracture toughness of the high T-g epoxy (EPON 828: diamino diphenyl sulfone) is doubled by the addition of 20 wt % PBAE alone and tripled by the addition of both microcapsules and the thermoplastic phase. Self-healing is achieved with up to 57% recovery of virgin fracture toughness of the toughened epoxy. Healing performance and fracture toughness of the self-healing system remain stable after aging 30 days. The relative amount of thermoplastic phase and the presence of solvent-filled microcapsules influence the storage modulus, T-g, and healing performance of the polymer. (C) 2015 Elsevier Ltd. All rights reserved.