This work researched the electroless deposition of copper layer onto the surface modified polyimide (PI) film. The surface modification was done using a base solution treatment and an activation layer of Ag. Finally metal copper layer was then deposited on this modified surface using the electroless plating technique. The thickness and surface morphology of copper layer on the polyimide films were characterized with atomic force microscopy (AFM), scanning electron microscopy (SEM). The chemical binding of the prepared films was studied with FT-IR.