Magnetron sputtering has become one of most useful methods for depositing thin films. However this coating technique has low target utilization and target life time. In this paper a new cathode unit was designed and tested with the simulation of magnetic field to extend the life time of target. The Cu target utilization was increased up to 45% compared to the conventional sputtering cathode. The thickness variation of thin films deposited was also improved in this method. Discharge property, thin films thickness and erosion depth were measured for the whole life time of target. These results were compared with the data obtained with a conventional cathode unit used in the magnetron sputter.