Previous Article Next Article Table of Contents Journal of Materials Science Letters, Vol.16, No.24, 2026-2028, 1997 DOI10.1023/A:1018548414552 Export Citation Partial transient liquid-phase bonding of Si3N4 with Ti/Cu/Ni multi-interlayers Zheng C, Lou HQ, Fei Z, Li ZZ Please enable JavaScript to view the comments powered by Disqus.
