This article reports on the texturing of silicon surface in microscale dimensions based on the formation of a polymeric layer on a silicon surface. The polymer layer is made porous by initially incorporating foreign material within it, followed by removal of the foreign material to leave behind pores. The pores in the polymer are of microscale dimensions having an interconnected structure, allowing the polymer layer to function as a chemical etch mask. The interconnected pores allow an etchant to access and etch the underlying silicon, resulting in texturing of the silicon surface. The texturing of silicon can be controlled, among other factors, by adjusting porosity in the polymer layer. (C) 2010 American Vacuum Society. [DOI: 10.1116/1.3507890]