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Journal of Electroanalytical Chemistry, Vol.642, No.1, 98-101, 2010
Electrochemical adsorption studies of urea on copper surface in alkaline medium
The inhibitive action of urea on the corrosion behavior of copper was investigated in borate buffer pH (8.4) by means of cyclic voltammetry and electrochemical impedance spectroscopy (EIS). A consistent trend of increase in inhibition efficiency was observed as a function of concentration of urea. The adsorption of urea on copper surface was found to obey the Langmuir adsorption isotherm with Delta G = -35.2 kJ/mole and adsorption constant K = 2.7 x 10(4) dm(3)/mole. Impedance spectroscopic measurements confirmed that charge transfer resistance increases in presence of urea upon increasing its concentration. (C) 2010 Elsevier B.V. All rights reserved.