Effect of a Multi-Step Gap-Filling Process to Improve Adhesion between Low-K Films and Metal Patterns

Woojin Lee; Tae Hyung Kim; Yong-Ho Choa

Korean Journal of Materials Research, Vol.26, No.8, 427-429, August, 2016

DOI10.3740/MRSK.2016.26.8.427 Export Citation

Effect of a Multi-Step Gap-Filling Process to Improve Adhesion between Low-K Films and Metal Patterns

Woojin Lee, Tae Hyung Kim¹, and Yong-Ho Choa^{1, †}

Process Development Team, Semiconductor R&D Center, Samsung Electronics Co., LTD, Samsungjeonja-ro 1, Hwaseong-si, Gyeonggi-do 17113, Republic of Korea
¹Department of Fusion Chemical Engineering, Hanyang University, 55 Hanyangdaehak-ro, Sangrok-gu, Ansan, Gyeonggi-do 15588, Republic of Korea

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A multi-step deposition process for the gap-filling of submicrometer trenches using dimethyldimethoxysilane (DMDMOS), (CH3)2Si(OCH3)2, and CxHyOz by plasma enhanced chemical vapor deposition (PECVD) is presented. The multistep process consisted of pre-treatment, deposition, and post-treatment in each deposition step. We obtained low-k films with superior gap-filling properties on the trench patterns without voids or delamination. The newly developed technique for the gapfilling of submicrometer features will have a great impact on inter metal dielectric (IMD) and shallow trench isolation (STI) processes for the next generation of microelectronic devices. Moreover, this bottom up gap-fill mode is expected to be universally for other chemical vapor deposition systems.

Keywords:gap fill;pecvd;low-k;trench pattern;inter metal dielectric;shallow trench isolation

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[1] Borhr M, Elmansy YA, IEEE Trans. Electron Devices, 45, 620 (1998)

[2] The International Technology Roadmap for Semiconductors. 2004 Update.

[3] Wu ZC, Shiung ZW, Chiang CC, Wu WH, Chen MC, Jeng SM, Chang W, Chou PF, Jang SM, Yu CH, Liang MS, J. Electrochem. Soc., 148(6), F115 (2001)

[4] Lee GY, Edelstein DC, Conti R, Cote W, Low KS, Dobuzinsky D, Feng G, Dev K, Wrschka P, Shafer P, Ramachandran R, Simpson A, Liniger E, Simonyi E, Dalton T, Spooner T, Jahnes C, Kaltalioglu E, Grill A, Advanced Metallization Conference, SanDiego, CA, 3-5 (2000).

[5] Grill A, Patel V, Mater. Res. Soc. Symp. Proc., 612, D2.9.1 (2000)

[6] Shim KC, Lee HB, Kwon OK, Park HS, Koh W, Kang SW, J. Electrochem. Soc., 149(2), G109 (2002)