A Ge thin film deposited by chemical vapor deposition (CVD) was used to obtain a uniform bonding between Au and Ge films for applications of wafer level packages (WLPs). This Ge CVD thin film showed selective growth on Au and Cu metals when the substrate has both metal and oxide. A one-step and two-step Ge deposition followed by eutectic bonding method was employed to bond the wafers. The samples were characterized by X-ray diffraction, field emission scanning electron microscopy equipped with an energy dispersive spectroscopy (FESEM-EDS), atomic force microscopy, high resolution Field emission transmission electron microscopy, IR inspection tool and secondary ion mass spectroscopy (SIMS). According to the IR inspection results, the two-step Ge deposited sample showed more uniform film compared to one-step deposition after eutectic bonding. Moreover, an improved bonding quality was obtained from the two-step process. Based on FESEM observations, a uniform and crater-free interface was detected between the bonded 4-inch wafers, in which the presence of Ge beside Au and Si was confirmed by EDS. SIMS profiles proved the formation of a thin Au-Ge interlayer at the bonded interface, which enhanced the bonding conditions. (C) 2016 Elsevier B.V. All rights reserved.