Advanced Materials, Vol.28, No.38, 8371-8378, 2016
Simultaneous Roll Transfer and Interconnection of Flexible Silicon NAND Flash Memory
Ultrathin silicon-based flexible 16 x 16 NAND flash memory (f-NAND) is demonstrated utilizing roll-to-plate packaging. The roll-based thermo-compression bonding of the anisotropic conductive film (ACF) transfers and simultaneously interconnects the f-NAND on a flexible printed circuit board. Reliable circuitry operation of the 16 x 16 f-NAND is confirmed with excellent flexibility and stable ACF interconnections.
Keywords:flexible ACF packaging;flexible NAND flash memory;roll-to-plate technology;ultrathin silicon-based flexible electronics