Thermoelectric self-cooling was firstly conceived to increase, without electricity consumption, the cooling power of passive cooling systems. This paper studies the combination of heat pipe exchangers and thermoelectric self-cooling, and demonstrates its applicability to the cooling of power electronics. Experimental tests indicate that source-to-ambient thermal resistance reduces by around 30% when thermoelectric self-cooling system is installed, compared to that of the heat pipe exchanger under natural convection. Neither additional electric power nor cooling fluids are required. This thermal resistance reaches 0.346 KM for a heat flux of 24.1 kW/m(2), being one order of magnitude lower than that obtained in previous designs. In addition, the system adapts to the cooling demand, reducing this thermal resistance for increasing heat. Simulation tests have indicated that simple system modifications allow relevant improvements in the cooling power. Replacement of a thermoelectric module with a thermal bridge leads to 33.54 kW/m(2) of top cooling power. Likewise, thermoelectric modules with shorter legs and higher number of pairs lead to a top cooling power of 44.17 kW/m(2). These results demonstrate the applicability of thermoelectric self-cooling to power electronics. (C) 2016 Elsevier Ltd. All rights reserved.