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Biomacromolecules, Vol.17, No.12, 3853-3861, 2016
POSS-Containing Bioinspired Adhesives with Enhanced Mechanical and Optical Properties for Biomedical Applications
A new terpolymer adhesive, poly(2-methoxyethyl acrylate-co-N-methacryloyl 3,4-dihydroxyl-L-phenylalanine-co-heptaisobutyl substituted polyhedral oligomeric silsesquioxane propyl methacrylate) (poly(MEA-co-MDOPA-co-MPOSS) was synthesized by thermally initiated radical polymerization. In this study, we investigated the effect of the POSS component on adhesion, mechanical, and optical properties of the catechol-group containing bioinspired adhesives. The terpolymer contains the catechol group which is known to improve the adhesion properties of polymers. Only a very small amount of the POSS-containing monomer, MPOSS, was included, 0.5 mol %. In the presence of POSS, the synthesized poly(MEA-co-MDOPA-co-MPOSS) demonstrated strong adhesion properties, 23.2 +/- 6.2 J/m(2) with 0.05 N preloading and 300 s holding time, compared to many previously prepared catechol-containing adhesives. The mechanical properties (Young's modulus and stress at 10% strain) of the POSS-containing terpolymer showed significant increases (6-fold higher) over the control polymer, which does not contain POSS. Optical transmittance of the synthesized terpolymer was also improved significantly in the visible light range, 450-750 nm. Cell testing with human embryonic kidney cells (HEK293A) indicates that the new terpolymer is a promising candidate in biomedical adhesives without acute cytotoxicity. The synthesized poly(MEA-co-MDOPA-co-MPOSS) is the first example of POSS-containing pressure sensitive bioinspired adhesive for biomedical applications. The study of poly(MEA-co-MDOPA-co-MPOSS) demonstrated a convenient method to enhance two important properties, mechanical and optical properties, by the addition of a very small amount of POSS. Based on this study, it was found that POSS can be used to strengthen mechanical properties of bioinspired adhesive without the need for a covalent cross-linking step.