Polymer(Korea), Vol.41, No.2, 331-338, March, 2017
자외선 경화형 아크릴계 점착제의 단량체 및 올리고머 함량이 실크 스크린의 인쇄성 및 점착력에 미치는 영향
Effects of Acrylic Monomers and Oligomer Contents on the Silk Screen Printability and Adhesion of UV Curing Acrylic Adhesive
E-mail:
초록
자외선 경화형 아크릴계 단량체의 함량을 조절하여 디스플레이 모듈 접합에 사용할 수 있는 점착제를 중합하고 점착 물성 및 실크스크린 인쇄성을 평가하였다. 2-ethylhexyl acrylate(2-EHA)와 아크릴 산(AA) 93:7 비율을 기본처방으로 하여 점착력을 갖도록 하였으며, 기본 처방에 스크린 탈착성 향상을 위한 butyl acrylate(BA), 점착력 향상을 위해 2-hydroxyethyl acrylate(2-HEA)와 tetrahydrofurfuryl acrylate(THFA)를 각각 추가하였다. 기본처방에서 BA의 함량이 7 phr 이상일 때 타래길이는 급격히 감소하고 점착력은 증가하였다. 2-HEA가 3 phr 이상에서 접촉각은 작아지고 폴리카보네이트(PC)에서의 점착력이 감소하는 경향을 보였다. 실크스크린 인쇄 시 직진성과 인쇄퍼짐을 개선하기 위해 THFA를 시럽에 첨가함에 따라 2-HEA가 14 phr의 경우, 점착제의 인쇄성이 저하되는 것으로 나타났다. 결과적으로 기본 처방에 BA 7 phr, 2-HEA 3 phr 및 THFA 7 phr를 첨가했을 때 인쇄성이 가장 양호하였다.
For application to display module junction, silk screen printing based on UV-curable acrylic adhesive was studied. Monomers were based on 2-ethylhexyl acrylate (2-EHA) and acrylic acid (AA) 93:7, butyl acrylate (BA), 2-hydroxyethyl acrylate (2-HEA) and tetrahydrofurfuryl acrylate (THFA) added for screen detachability and adhesion, respectively. When the ratio of BA in monomers was added above 7 phr, adhesive was less smeared the screen and spreading length of adhesive decreased, and its adhesion increased. As 2-HEA was added above 3 phr, contact angle decreased and peel strength also decreased on polycarbonate (PC) substrate. When 2-HEA ratio was 14 phr with THFA was added for screen printability include linearity and printing width, the printability of adhesive showed to decrease. As a result, BA 7 phr, 2-HEA 3 phr, and THFA 7 phr with based monomers had good printability.
- Sung IK, Park GH, Gong WS, Park SH, J. Adhes. Interface, 15, 176 (2014)
- Park ES, Park JW, Kim HJ, Polym. Sci. Technol., 23, 48 (2012)
- Athijayamani A, Ganesamoorthy R, Loganathan KT, Sidhardhan S, Polym. Korea, 40(1), 1 (2016)
- Park CH, Kim HJ, Polym. Sci. Technol., 26, 314 (2015)
- Baek SS, Jang SJ, Lee JH, Kho DH, Lee SH, Hwang SH, Polym. Korea, 38(2), 199 (2014)
- Baek SS, Jang SJ, Lee SW, Hwang SH, Polym. Korea, 38(5), 682 (2014)
- Yoon GS, Shin CH, Min BG, Elast. Compos., 24, 309 (1989)
- Piglowski J, Kozlowski M, Rheol. Acta, 24, 519 (1985)
- Kim SJ, Master’s Thesis, KAIST, Korea (2012).
- Park J, Kim C, Korean Chem. Eng. Res., 48(3), 397 (2010)
- Kim DB, Polym. Korea, 37(2), 184 (2013)
- Subedi DP, The Himalayan Physics, vol II, 3 (2011).
- Chang MC, Mao CL, Vargas RR, U.S. Patent 4,564,664 (1986).
- Krampe SE, Moore CL, Taylor CW, U.S.Patent 4,732,808 (1988).