In this paper, a benzoxazine-based (BZ) adhesive with high temperature resistant was developed by blending benzoxazine monomer and tetrafonctional epoxy monomer as matrix modifier and polyetherimide as toughening agent. The results show that benzoxazine-based film adhesive could be cured at 190 degrees C, and the cured film adhesive exhibited high temperature resistance and a high glass transition temperature of 224 degrees C. The 5% weight loss temperature in air was 400 degrees C and the char yield in nitrogen at 800 degrees C was 48%. The cured film adhesive has good ablation resistance. The fabricated benzoxazine-based film adhesive has high adhesion reliability, with single-lap shear strength of 23.20, 28.36 and 20.04 MPa at room temperature, 140 and 175 degrees C respectively. The curing process of the film adhesive matches well with that of carbon fiber reinforced BZ prepreg and the film adhesive has stable adhesion properties. Its biggest advantage is that, during storage and transportation, there is no need of refrigeration. After 60 days of storage for benzoxazine-based film adhesive at room temperature, its process performance and adhesion properties remain unchanged. It is expected that the benzoxazine-based film adhesive can be used in aerospace, high-speed rail and other applications.