Journal of Supercritical Fluids, Vol.127, 200-207, 2017
Deposition of PMDA-TFDB type polyimide onto microscale trenches patterned on silicon wafer using supercritical carbon dioxide
Reactivities of two polyimide (PI) monomer pairs, namely, pyromellitic dianhydride (PMDA, Kapton type tetracarboxylic dianhydride) and 2,2'-bis(trifluoromethyl)-4,4'-diaminobiphenyl (TFDB, fluorinated aromatic diamine) as well as 2,2-bis(3,4-anhydrodicarboxyphenyl)-hexafluoropropane (6FDA, fluorinated tetracarboxylic dianhydride) and 4,4'-diaminodiphenyl ether (ODA, Kapton type aromatic diamine) in forming polyamic acid (PAA, precursor of PI) were investigated in a mixture of supercritical carbon dioxide (scCO(2)) and 20 mol% N,N-dimethylformamide (DMF) by observing the phase changes occurred at 50 degrees C and 30 MPa. The results implicitly indicated that the growth rate of PAA of the PMDA-TFDB pair was lower than that of the 6FDA-ODA pair. Furthermore, the deposition of PI of the PMDA-TFDB pair onto microscale trenches was carried out in scCO2 containing 20 mol% DMF. The amount of PI (and PAA) of the PMDA-TFDB pair deposited inside the trenches increased with an increase in the monomer concentration and a decrease in the deposition temperature ranging from 100 to 250 degrees C. (C) 2017 Elsevier B.V. All rights reserved.