Micro pin fin arrays have been widely used in electronic cooling, micro reactors, catalyst support, and wettability modification and so on, and a facile way to produce better micro pin fin arrays is demanded. Herein, a simple electrochemical method has been developed to fabricate copper vertical micro dendrite fin arrays (Cu-VMDFA) with controllable shapes, number density and height. High copper sulphate concentration is one key point to make the dendrite stand vertically. Besides, the applied current should rise at an appropriate rate to ensure the copper dendrite can grow vertically on its own. The Cu-VMDFA can significantly enhance the heat transfer coefficient by approximately twice compared to the plain copper surface. The Cu-VMDFA may be widely used in boiling heat transfer areas such as nuclear power plants, electronic cooling, heat exchangers, and so on. (C) 2017 Elsevier B.V. All rights reserved.