Copper electrodeposition occurs in two steps and a practical electrodeposition normally needs several additives that require kinetic parameters for the calculation of current density and the concentration of intermediates. The copper electrodeposition was considered as a surface reaction, the exponential part of Butler-Volmer equation contributes to the value of reaction rate constant while the exchange current density relates to both the reaction rate constant and the surface concentration of cupric and cuprous ions. Two models for the adsorption of an additive or two additives on electrode surface were supposed. Using cyclic voltammetric stripping and chronoamperometry method, the electron bridge performance of chloride and the interaction of chloride with SPS were quantitatively compared with the non-additive copper electrodeposition. (C) 2017 The Electrochemical Society. All rights reserved.