This works aims at exploring the effects of dual ion beam sputtering-assembled W-rich copper-tungsten films. The film characterization was performed by means of X-ray diffraction and magnetic coating thickness testing. Our results indicate a gradual change in the tungsten structure-from approximately metastable and amorphous to crystalline-as the Ar+ ion energy increases during the sputtering process. Due to the reflection effect, an increase in film thickness was also observed with increasing energy. At lower energies, the film deposition become very difficult due to the atomic shot peening effect. (C) 2017 Elsevier B.V. All rights reserved.