Transitional analysis of organic thin color filter layers in displays during baking process using multi-speckle diffusing wave spectroscopy

Baek Sung Park; Kyung Hee Hyung; Gwi Jeong OH; Hyun Wook Jung

Korea-Australia Rheology Journal, Vol.30, No.1, 11-19, February, 2018

DOI10.1007/s13367-018-0002-1 Export Citation

Transitional analysis of organic thin color filter layers in displays during baking process using multi-speckle diffusing wave spectroscopy

Baek Sung Park^{1, 2}, Kyung Hee Hyung², Gwi Jeong OH^{1, 2}, and Hyun Wook Jung^{1, †}

¹Department of Chemical and Biological Engineering, Korea University, 145 Anam-ro, Seongbuk-gu, Seoul 02841, Republic of Korea
²Samsung SDI, 130 Samsung-ro, Yeongtong-gu, Suwon 16678, Republic of Korea

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The color filter (CF) is one of the key components for improving the performance of TV displays such as liquid crystal display (LCD) and white organic light emitting diodes (WOLED). The profile defects like undercut during the fine fabrication processes for CF layers are inevitably generated through the UV exposure and development processes, however, these can be controlled through the baking process. In order to resolve the profile defects of CF layers, in this study, the real-time dynamic changes of CF layers are monitored during the baking process by changing components such as polymeric binder and acrylate. The motion of pigment particles in CF layers during baking is quantitatively interpreted using multi-speckle diffusing wave spectroscopy (MSDWS), in terms of the autocorrelation function and the characteristic time of α-relaxation.

Keywords:multi-speckle diffusing wave spectroscopy;undercut;CF layer;baking process;rheology;displays

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[1] Bellour M, Knaebel A, Harden JL, Lequeux F, Munch JP, Phys. Rev. E, 67, 031405 (2003)

[2] Brunel L, Brun A, Snabre P, Cipelletti L, Opt. Express, 15, 15250 (2007)

[3] Chu C, Ha J, Choi J, Lee S, Rhee J, Lee D, Chung J, Kim H, Chung K, SID Symp. Digest Tech. Papers, 38, 1118 (2007)

[4] Chuang YJ, Tseng FG, Lin WK, Microsyst. Technol., 8, 308 (2002)

[5] Cohen-Addad S, Hohler R, Phys. Rev. Lett., 86, 4700 (2001)

[6] Han CW, Kim KM, Bae SJ, Choi HS, Lee JM, Kim TS, Tak YH, Cha SY, Ahn BC, SID Symp. Digest Tech. Papers, 43, 279 (2012)

[7] Knaebel A, Bellour M, Munch JP, Viasnoff V, Lequeux F, Harden JL, Europhys. Lett., 52, 73 (2000)

[8] Kudo T, Nanjo Y, Yamaguchi Y, Yamaguchi H, Kang WB, Pawlowski G, Jpn. J. Appl. Phys., 37, 3594 (1998)

[9] Kunic S, Sego Z, International Symposium, Zadar, Croatia, 83-87 2013.

[10] Lee JY, Hwang JW, Jung HW, Kim SH, Lee SJ, Yoon K, Weitz DA, Langmuir, 29(3), 861 (2013)

[11] Lin W, Wu WB, Cheng KC, Li HH, Handbook of Visual Display Technology, Springer, Berlin, 2012.

[12] Loechel B, Demmeler R, Rothe M, Bruenger W, Fehlberg S, Gruetzner G, J. Vac. Sci. Technol. B, 14(6), 4179 (1996)

[13] Mentley DE, Proc. IEEE, 90, 453 (2002)

[14] Narita T, Beauvais C, Hebraud P, Lequeux F, Eur. Phys. J. E, 14, 287 (2004)

[15] Oh GJ, Hwang JW, Bong KW, Jung HW, Lee SJ, AIChE J., 63(3), 1114 (2017)

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[17] Park SH, Kang M, Seo DY, Kong HS, Ro HK, Proceedings of KSPE 2012 spring Conference, Jeju, Republic of Korea, 457-458 2012.

[18] Sabnis, RW, Displays, 20, 119 (1999)

[19] Tsuda K, Displays, 14, 115 (1993)

[20] Viasnoff V, Lequeux F, Pine DJ, Rev. Sci. Instrum., 73, 2336 (2002)

[21] Viasnoff V, Jurine S, Lequeux F, Faraday Discuss., 123, 253 (2003)

[22] Yen TC, Tso PL, Jpn. J. Appl. Phys., 43, 4229 (2004)