Advanced Powder Technology, Vol.29, No.4, 996-1004, 2018
Investigation of natural convection heat transfer performance of the QFN-PCB electronic module by using nanofluid for power electronics cooling applications
Natural convection heat transfer of Cu-water nanofluid in a 3 x 3 array of a typical isothermal quad flat non-lead (QFN) embedded printed circuit board (PCB) module which can be bounded with respect to the sealed non-Darcy porous enclosure is numerically investigated. The Darcy-Brinkman-Forchheimer model is adopted to model the fluid flow in the porous medium under the presence of an external magnetic field. The transport governing equations are solved by the finite volume method based on the SIMPLE algorithm and the power law scheme. Main efforts focus on the effects of the parameters such as a nanoparticle volume fraction, Hartmann number, Darcy number and the enclosure side aspect ratio on the fluid flow and heat transfer characteristics inside the enclosure. The obtained results indicate that the influence of nanofluid of the overall Nusselt number increases with increasing the Darcy number, but decreases with increasing the Hartmann number. The overall Nusselt number attains its maximum value in the range of enclosure side aspect ratio from 1.5 to 3 with respect to the Darcy number. Moreover, the proposed correlations improve the efficiency, reliability and stability of the electronic device encountered in various applications in electronic industries. (C) 2018 The Society of Powder Technology Japan. Published by Elsevier B.V. and The Society of Powder Technology Japan. All rights reserved.