The development of a one-component epoxy adhesive for cell phone board repair was described. The most important goal of this study is to obtain long storage stability in conjunction with the curing reaction process at a relatively low temperature of 95 degrees C. Bisphenol-A type, bisphenol-F type, and NBR-based epoxy resins were used as the basic resins. Dicyandiamide (DICY) was used as a curing agent, and 2-methylimidazole (2MI) was used as an accelerator. 2MI was encapsulated using a copolymer of methacrylic acid and dodecyl methacrylate to achieve latent curing performance. After mixing the epoxy resin with DICY and encapsulated 2MI, this curing system showed excellent storage stability with almost no viscosity increase for 2months at 20 degrees C, and full curing was achieved at 95 degrees C for 50min. We determined the optimum formulation of the epoxy adhesive for adhesion of a cell phone board after the measurement of physical properties.