The deformation response of random grain boundary networks as a function of temperature and strain rate is explored using molecular dynamics atomistic simulations and an embedded atom method interatomic potential. We find that deformation at higher temperatures promotes both dislocation emission and grain boundary accommodation processes. The results allow estimating the activation energies and volumes for the deformation process. We find activation energy values for the deformation process similar to those for grain boundary diffusion and activation volumes consistent with an atomic shuffling mechanism. Our results suggest a picture of the deformation process as governed by the combination of the applied stress and thermally activated processes.