Differential scanning calorimetry (DSC) was used to measure the kinetic parameters of the EPON 862/W epoxy system (Shell EPON(R) Resin DPL-862/EPON CURING AGENT(R) W/EPON CURING AGENT(R) Accelerator 537). Heat of reaction, degree of cure, pre-exponential constant, and activation energy were determined using dynamic scanning at heating rates of 5, 10, and 20 degrees C/min. Using a Brookfield DV-III rotational-type rheometer, the viscosity was measured isothermally as a function of time at temperatures of 23 degrees, 35 degrees, 45 degrees, 55 degrees, 65 degrees, 80 degrees, 90 degrees, and 100 degrees C. Experimental modeling of the rheological characteristics of the resin was conducted using expressions correlating the viscosity and the degree of cure. Viscosities calculated by the model were in good agreement with data obtained experimentally.