Design of h-BN-Filled Cyanate/Epoxy Thermal Conductive Composite with Stable Dielectric Properties

Yangxue Lei; Zengmao Han; Dengxun Ren; Hai Pan; Mingzhen Xu; Xiaobo Liu

Macromolecular Research, Vol.26, No.7, 602-608, July, 2018

DOI10.1007/s13233-018-6090-4 Export Citation

Design of h-BN-Filled Cyanate/Epoxy Thermal Conductive Composite with Stable Dielectric Properties

Yangxue Lei, Zengmao Han, Dengxun Ren, Hai Pan, Mingzhen Xu^†, and Xiaobo Liu^†

Research Branch of Advanced Functional Materials, School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu, 611731, P. R. China

E-mail:,

The thermal conductive cyanate ester/epoxy (CE/AG80) composites with hexagonal boron nitride (h-BN) reinforced were manufactured and investigated. The low and stable dielectric constant/loss of the composites with respect to both frequency (500 Hz-100 kHz) and temperature (50-350 °C) were discussed as functions of the content of h-BN. It was found that the low and stable dielectric constant/ loss of the composites can be maintained in the whole frequency range at room temperature, and the mutations of constant/loss at the frequency of 1 kHz occurred above 280 °C for all of the samples. Moreover, a remarkable enhancement of the thermal conductivity (0.54 W/mK a 1.8-fold enhancement) was achieved with the introduction of h-BN and significantly outperformed traditional thermal conductive fillers. The significant improvements of the thermal conductivity of the composites were analyzed by the Agari’s model and the parameters of C1 and C2 were also calculated.

Keywords:dielectric properties;thermal conductivity;composites;hexagonal boron nitride

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[Referenced By]

[1] Boudenne A, Ibos L, Fois M, Majeste J, Gehin E, Compos. Pt. A-Appl. Sci. Manuf., 36, 1545 (2005)

[2] Singha S, Thomas MJ, IEEE Trans. Dielectr. Electr. Insul., 15, 12 (2008)

[3] He H, Fu RL, Han YH, Shen Y, Song XF, J. Mater. Sci., 42(16), 6749 (2007)

[4] Meziani MJ, Song WL, Wang P, Lu F, Hou Z, Anderson A, Maimaiti H, Sun YP, Chem. Phys. Chem., 16, 1339 (2015)

[5] Shi Z, Radwan M, Kirihara S, Miyamoto Y, Jin Z, Appl. Phys. Lett., 95, 224104 (2009)

[6] Yung KC, Liem H, J. Appl. Polym. Sci., 106(6), 3587 (2007)

[7] Zhou W, Wang C, Ai T, Wu K, Zhao F, Gu H, Compos. Pt. A-Appl. Sci. Manuf., 40, 830 (2009)

[8] Sato K, Horibe H, Shirai T, Hotta Y, Nakano H, Nagai H, Mitsuishi K, Watari K, J. Mater. Chem., 20, 2749 (2010)

[9] Yu SZ, Hing P, Hu X, Compos. Pt. A-Appl. Sci. Manuf., 33, 289 (2002)

[10] Kemaloglu S, Ozkoc G, Aytac A, Polym. Compos., 31, 1398 (2009)

[11] Huang X, Xie L, Jiang P, Wang G, Liu F, J. Phys. D-Appl. Phys., 42, 245407 (2009)

[12] Yu S, Hing P, Hu X, Compos. Pt. A-Appl. Sci. Manuf., 33, 289 (2002)

[13] Gu JW, Guo YQ, Yang XT, Liang CB, Geng WC, Tang L, Li N, Zhang QY, Compos. Pt. A-Appl. Sci. Manuf., 95, 267 (2017)

[14] Yu A, Ramesh P, Itkis ME, Bekyarova E, Haddon RC, J. Phys. Chem. C, 111, 7565 (2007)

[15] Gu JW, Liang CB, Zhao XM, Gan B, Qiu H, Guo YQ, Yang XT, Zhang QY, Wang DY, Compos. Sci. Technol., 139, 83 (2017)

[16] Gu JW, Lv ZY, Wu YL, Guo YQ, Tian LD, Qiu H, Li WZ, Zhang QY, Compos. Pt. A-Appl. Sci. Manuf., 94, 209 (2017)

[17] Eloundou JP, Eur. Polym. J., 38, 431 (2002)

[18] Pu Z, Chen L, Tong L, Long Y, Huang X, Liu X, Mater. Lett., 109, 116 (2013)

[19] Huang X, Pu Z, Feng M, Tong L, Liu X, Mater. Lett., 96, 139 (2013)

[20] Broido A, Polym. Phys., 2, 1761 (1969)