Treatment of Atmospheric-Pressure Radio Frequency Plasma on Boron Nitride for Improving Thermal Conductivity of Polydimethylsiloxane Composites

Yeongseon Kim; Sosan Hwang; Jae Il So; Chae Lin Kim; Minjae Kim; Sang Eun Shim

Macromolecular Research, Vol.26, No.10, 864-867, October, 2018

DOIceramics, polymeric composites, functional, thermal properties Export Citation

Treatment of Atmospheric-Pressure Radio Frequency Plasma on Boron Nitride for Improving Thermal Conductivity of Polydimethylsiloxane Composites

Yeongseon Kim, Sosan Hwang, Jae Il So, Chae Lin Kim, Minjae Kim, and Sang Eun Shim^†

Department of Chemistry & Chemical Engineering, Inha University, 100 Inharo, Namgu, Incheon 22212, Korea

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Boron nitride (BN) particles were treated with atmospheric-pressure radio frequency plasma and then modified using a triethoxyvinyl silane coupling agent in order to enhance the thermal conductivity of polydimethylsiloxane (PDMS) composites. Raw BN, silane-treated BN, and silane-plasma-treated BN were incorporated into PDMS matrix. The surface modification by plasma and coupling agent was verified. The composites filled with treated BN showed a superior effect on thermal conductivity compared to the raw BN filled composite at the same filler loading. Specifically, using silane-plasma-treated BN at 40 wt% of BN increased the thermal conductivity from 1.7 to 3.4 W/mK.

Keywords:ceramics;polymeric composites;functional;thermal properties

[References]

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Cho HB, Nakayama T, Suematsu H, Suzuki T, Jiang W, Niihara K, Song E, Eom NSA, Kim S, Cha YH, Compos. Sci. Technol., 129, 205 (2016)
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Lin Y, Williams TV, Xu TB, Cao W, Elsayed-Ali HE, Connell JW, J. Phys. Chem. C, 115, 2679 (2011)
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Bhimanapati GR, Kozuch D, Robinson JA, Nanoscale, 6, 11671 (2014)
Kim M, Kim Y, Bacek SH, Shim SE, Carbon Lett., 16, 34 (2015)
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Das T, Banthia AK, Adhikari B, Jeong H, Ha CS, Alam S, Macromol. Res., 14(3), 261 (2006)
Cho D, Yun SH, Kim J, Lim S, Park M, Lee SS, Lee GW, Macromol. Res., 12(1), 119 (2004)
Zhang Y, Li X, Ge X, Deng F, Cho UR, Macromol. Res., 23(10), 952 (2015)
Joni IM, Balgis R, Ogi T, Iwaki T, Okuyama K, Colloids Surf. A: Physicochem. Eng. Asp., 338, 49 (2011)
Kim SH, Kim JH, Kang BK, Uhm HS, Langmuir, 24, 12213 (2005)
Allcock HR, Steely LB, Kim SH, Kim JH, Kang BK, Langmuir, 23(15), 8103 (2007)
Moon SY, Han JW, Choe W, Thin Solid Films, 506, 355 (2006)
Li TL, Hsu SLC, J. Phys. Chem. B, 114(20), 6825 (2010)
Longhi M, Kunsta SR, Beltrami LVR, Kerstner EK, Filho CIS, Sarmento VHV, Malfatti C, Mater. Res., 18, 1140 (2015)

[Related Articles]

[1] Chen H, Ginzburg VV, Yang J, Yang Y, Liu W, Huang Y, Du L, Chen B, Prog. Polym. Sci, 59, 41 (2016)

[2] Cho HB, Nakayama T, Suematsu H, Suzuki T, Jiang W, Niihara K, Song E, Eom NSA, Kim S, Cha YH, Compos. Sci. Technol., 129, 205 (2016)

[3] Zhou W, Zuo J, Zhang X, Zhou A, J. Compos. Mater., 48, 2517 (2014)

[4] Sato K, Horibe H, Shirai T, Hotta Y, Nakamo H, Watari K, J. Mater. Chem., 20, 2749 (2010)

[5] Electrochim. Acta, Gowda A, Paisner SN, Tonapi S, Meneghetti P, Hans P, Strosaker G, Acharya A, Nagarkar K, Srihari K, Electronics Packaging Technology Conference, Dec. 7-9, 2005.

[6] Zhou W, Wang Z, Dong L, Sui X, Chen Q, Compos. Part A, 79, 183 (2015)

[7] Lin Y, Williams TV, Xu TB, Cao W, Elsayed-Ali HE, Connell JW, J. Phys. Chem. C, 115, 2679 (2011)

[8] Wang Z, Fu Y, Meng W, Zhi C, Nanoscale Res. Lett., 9, 643 (2014)

[9] Cui Z, Oyer AJ, Glover AJ, Schniepp HC, Adamson DH, Small, 10, 2352 (2014)

[10] Xiao F, Naficy S, Casillas G, Khan MH, Katkus T, Jiang L, Liu HK, Li HJ, Huang ZG, Adv. Mater., 27(44), 7196 (2015)

[11] Bhimanapati GR, Kozuch D, Robinson JA, Nanoscale, 6, 11671 (2014)

[12] Kim M, Kim Y, Bacek SH, Shim SE, Carbon Lett., 16, 34 (2015)

[13] Zhou W, Chen Q, Sui X, Dong L, Wang Z, Compos. Part A, 71, 184 (2015)

[14] Das T, Banthia AK, Adhikari B, Jeong H, Ha CS, Alam S, Macromol. Res., 14(3), 261 (2006)

[15] Cho D, Yun SH, Kim J, Lim S, Park M, Lee SS, Lee GW, Macromol. Res., 12(1), 119 (2004)

[16] Zhang Y, Li X, Ge X, Deng F, Cho UR, Macromol. Res., 23(10), 952 (2015)

[17] Joni IM, Balgis R, Ogi T, Iwaki T, Okuyama K, Colloids Surf. A: Physicochem. Eng. Asp., 338, 49 (2011)

[18] Kim SH, Kim JH, Kang BK, Uhm HS, Langmuir, 24, 12213 (2005)

[19] Allcock HR, Steely LB, Kim SH, Kim JH, Kang BK, Langmuir, 23(15), 8103 (2007)

[20] Moon SY, Han JW, Choe W, Thin Solid Films, 506, 355 (2006)

[21] Li TL, Hsu SLC, J. Phys. Chem. B, 114(20), 6825 (2010)

[22] Longhi M, Kunsta SR, Beltrami LVR, Kerstner EK, Filho CIS, Sarmento VHV, Malfatti C, Mater. Res., 18, 1140 (2015)