As the minimum features in semiconductor devices decrease, it is a new trend to incorporate copper and polymers with dielectric constant less than 3.0 to enhance the performance of the devices. Two fluorinated polymers, poly(biphenyl perfluorocyclobutyl ether) (BPFCB) and poly(1,1,1-triphenyl ethane perfluorocyclobutyl ether) (PFCB), are newly developed polymers with dielectric constants below 3.0. These two polymers have a similar backbone structure, but PFCB has the capability of crosslinking. To know the implications of these two polymers in the semiconductor industry, properties that are important for the integral reliability of Integral Circuits (IC), such as thermal and mechanical properties, should be understood. This comparative study shows that the crosslinking in perfluorocyclobutane aromatic ether polymer can reduce vertical thermal expansion and increase glass transition temperature (T-g) while water absorption, crystalline-like phase, and dielectric constant are slightly increased.