B와 W의 함량이 무전해 Co 합금 박막의 경도에 미치는 영향 연구

임태호; 김재정; Taeho Lim; Jae Jeong Kim

Korean Chemical Engineering Research, Vol.56, No.6, 895-900, December, 2018

DOI10.9713/kcer.2018.56.6.895 Export Citation

B와 W의 함량이 무전해 Co 합금 박막의 경도에 미치는 영향 연구

Effect of B and W Contents on Hardness of Electroless Co Alloy Thin Films

임태호^†, 김재정^{1, †}

숭실대학교 화학공학과, 06978 서울특별시 동작구 상도로 369
¹서울대학교 화학공정신기술연구소, 08826 서울 관악구 관악로 1

Taeho Lim^†, and Jae Jeong Kim^{1, †}

Department of Chemical Engineering, Soongsil University, 369, Sangdo-ro, Dongjak-gu, Seoul, 06978, Korea
¹Institute of Chemical Process, Seoul National University, 1, Gwanak-ro, Gwanak-gu, Seoul 08826, Korea

E-mail:,

초록

본 연구에서는 Co-B, Co-W-B 합금 박막 형성을 위한 무전해 전착법을 고안하고, 이를 통해 형성한 합금 박막의 B과 W의 함량이 박막의 경도에 미치는 영향을 살펴보았다. 무전해 전착을 통해 무정형 상태의 Co 합금 박막을 성공적으로 형성할 수 있었으며, 환원제인 dimethylamine borane과 W의 원료인 sodium tungstate dihydrate의 농도를 조절함으로써 Co 합금 박막 내 혼합되는 B과 W의 함량을 조절하였다. 이를 통해 Co 합금 박막 내 전위(dislocation)의 전파(propagation)를 억제하는 B과 W의 함량이 증가할수록 박막의 경도가 증가함을 확인할 수 있었다. 뿐만 아니라, 무전해 전착 시 포기(aeration)를 수행하지 않을 경우에 포기를 수행한 경우보다 Co 합금 박막 내 B과 W의 함량을 대폭 증가시킬 수 있었고 최종적으로 Co-W-B 합금 박막의 경도를 8.9 (±0.3) GPa까지 향상시켰다.

In this study, the electroless deposition of Co-B and Co-W-B alloy thin films was developed and the effect of B and W contents on the hardness of the alloy thin films were investigated. An amorphous Co alloy film was successfully formed by electroless deposition and the contents of B and W in the film were controlled by varying the concentrations of dimethylamine borane and sodium tungstate dihydrate, which were used as a reducing agent and W source, respectively. The hardness of the thin films increased as the contents of B and W were increased because B and W act as impurities suppressing the propagation of dislocation in a film. In addition, it was found that the content of B and W in the Co alloy films can be increased significantly when aeration is not performed. Finally, the hardness of Co- W-B alloy thin film was improved up to 8.9 (±0.3) GPa.

Keywords:Electroless;Cobalt;Hardness;Boron;Tungsten

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Goel V, Anderson P, Hall J, Robinson F, Bohm S, J. Magn. Magn. Mater., 407, 42 (2016)
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Hu B, Sun R, Yu G, Liu L, Xie Z, He X, Zhang X, Surf. Coat. Technol., 228, 84 (2013)
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Vaz F, Ferreira J, Ribeiro E, Rebouta L, et al., Surf. Coat. Technol., 191, 317 (2005)
Jiang WG, Su JJ, Feng XQ, Eng. Fract. Mech., 75, 4965 (2008)
Walter C, Antretter T, Daniel R, Mitterer C, Surf. Coat. Technol., 202, 1103 (2007)
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[2] Pillai AM, Rajendra A, Sharma AK, J. Coat. Technol. Res., 9(6), 785 (2012)

[3] Jappes WJT, Ramamoorthy, B, Nair KP, J. Mater. Process. Technol., 169, 308 (2005)

[4] Krishnaveni K, Narayanan STSN, Seshadri SK, Surf. Coat. Technol., 190, 115 (2005)

[5] Bangwei Z, Wangyu H, Qinglong Z, Xuanyuan Q, Mater. Charact., 37, 119 (1996)

[6] Jin ZY, Li PP, Zheng BZ, Xiao D, Mater. Corros., 64(4), 341 (2013)

[7] Park HJ, Oh EK, Kim SG, Yeu T, Korean Chem. Eng. Res., 32(3), 358 (1994)

[8] Nakano H, Itabashi T, Akahoshi H, J. Electrochem. Soc., 152(3), C163 (2005)

[9] Lim T, Koo HC, Kim KH, Park KJ, Kim MJ, Kwon OJ, Kim JJ, Electrochem. Solid-State Lett., 14(9), D95 (2011)

[10] Goel V, Anderson P, Hall J, Robinson F, Bohm S, J. Magn. Magn. Mater., 407, 42 (2016)

[11] Younan MM, Aly IHM, Nageeb MT, J. Appl. Elechem., 32, 439 (2002)

[12] Wang SL, Thin Solid Films, 515, 8419 (2007)

[13] Samsonov GV, Handbook of the physicochemical properties of the elements, 2nd ed., Plenum Publishing Corporation, New York, NY(1968).

[14] Einati H, Bogush V, Sverdlov Y, Rosenberg Y, Shacham-Diamand Y, Microelectron. Eng., 82, 623 (2005)

[15] Ofek Almog R, Sverdlov Y, Goldfarb I, Shacham-Diamand Y, Microelectron. Eng., 84, 2450 (2007)

[16] Kim TH, Yun HJ, Kim CK, Korean Chem. Eng. Res., 45(6), 633 (2007)

[17] Homma T, Tamaki A, Nakai H, Osaka T, J. Electroanal. Chem., 559, 131 (2003)

[18] Saito T, Sato E, Matsuoka M, Iwakura C, J. Appl. Elechem., 28, 559 (1998)

[19] Hu B, Sun R, Yu G, Liu L, Xie Z, He X, Zhang X, Surf. Coat. Technol., 228, 84 (2013)

[20] Meyers MA, Mishra A, Benson DJ, Prog. Mater. Sci., 51(4), 427 (2006)

[21] Vaz F, Ferreira J, Ribeiro E, Rebouta L, et al., Surf. Coat. Technol., 191, 317 (2005)

[22] Jiang WG, Su JJ, Feng XQ, Eng. Fract. Mech., 75, 4965 (2008)

[23] Walter C, Antretter T, Daniel R, Mitterer C, Surf. Coat. Technol., 202, 1103 (2007)

[24] Sverdlov Y, Bogush V, Einati H, Shacham-Diamand Y, J. Electrochem. Soc., 152(9), C631 (2005)

[25] Hanna F, Hamid A, Aal AA, Mater. Lett., 58, 104 (2003)