Various failure modes derived from the electrochemical migration (ECM) through the dielectric polymer layers have been considered critical issues in the electronic devices. Herein, we for the first time suggested the rationally designed epoxy/zeolitic imidazolate framework-8 (ZIF-8) nanocomposite materials for efficient suppression of copper ion migration based on the plausible reaction mechanisms of metal metathesis addressed by sequential cleaving and ligating between metal ions (Zn2+ and Cu2+) and 2-methylimidazole (2-mim) ligands. The fabrication process for epoxy/ZIF-8 (EZ) nanocomposites was first examined to optimize the crosslinking system. The capability of the metal ion capture in the EZ nanocomposites was examined using the aqueous solution containing Cu2+ ions. In addition, the ECM suppression properties were evaluated using the thermal humidity bias (THB) model testing. The representative model investigations with the EZ nanocomposites exhibited substantially enhanced copper ion adsorption and suppression of copper migration in comparison to those of epoxy. Hence, the EZ nanocomposites can be one promising material to alleviate the undesired ECM behavior in electronic device applications. (C) 2018 Elsevier Ltd. All rights reserved.