초음파를 이용한 구리-은 코어-쉘의 합성 및 전도성 페이스트 적용

심상보; 한종대; Sang-Bo Sim; Jong-Dae Han

Applied Chemistry for Engineering, Vol.29, No.6, 782-788, December, 2018

DOI10.14478/ace.2018.1097 Export Citation

초음파를 이용한 구리-은 코어-쉘의 합성 및 전도성 페이스트 적용

Sonochemical Synthesis of Copper-silver Core-shell Particles for Conductive Paste Application

심상보, 한종대^{1, †}

창성나노텍(주)
¹창원대학교 공과대학 토목환경화공융합공학부

Sang-Bo Sim, and Jong-Dae Han^{1, †}

Changsung Nanotech Co., Ltd., 80-59 Goldenroot-ro, Juchon-myeon, Gimhae-si, Gyeongsangnam-do 50969, Korea
¹School of Civil, Environmental and Chemical Engineering, Changwon National University, Changwon-si, Gyeongsangnam-do 51140, Korea

E-mail:

초록

서브 미크론 구리-은 코어-쉘 Cu@Ag 입자를 초음파화학과 결합된 금속교환 반응으로 합성하고 인쇄용 전자부품을 위한 저렴한 전도성 페이스트 적용을 평가하였다. 코어-쉘의 합성을 위한 반응에서 코어로 사용된 Cu2O/Cu 복합체의 Cu2O는 초음파화학 반응으로 Cu로 환원되고 Cu 원자는 Ag의 금속교환 반응의 환원제로 작용하여 코어 표면에 Ag가 코팅된 코어-쉘 구조를 얻었다. TEM-EDS와 TG-DSC를 이용하여 서브 미크론 입자의 코어-쉘 구조를 확인하였다. 70wt% Cu@Ag를 용매에 분산시킨 전도성 페이스트를 결합제와 습윤제를 사용하여 제조하고, 스크린 인쇄법을 사용하여 폴리아미드 필름상에 코팅하였다. Ag 함량이 8 at%와 16 at%인 Cu@Ag 입자를 함유하는 인쇄된 페이스트 필름은 공기 중의 180 ℃에서 소결한 후 각각 96.2와 38.4 μΩcm의 낮은 비저항 값을 나타내었다.

Submicron copper-silver core-shell (Cu@Ag) particles were synthesized using the sonochemical combined transmetallation reaction and the application to printed electronics as a low cost conductive paste was evaluated. Cu2O of the Cu2O/Cu composite used as a core in the reaction for the synthesis of core-shell was sonochemically reduced to Cu, and Cu atoms functioned as a reducer for silver ions in transmetallation to achieve the copper-silver core-shell structure. The characterization of submicron particles by TEM-EDS and TG-DSC confirmed the core-shell structure. Conductive pastes in which 70 wt% Cu@Ag was dispersed in solvents were prepared using a binder and wetting agents, and coated on the polyamide film using a screen-printing method. Printed paste films containing synthesized Cu@Ag particles with 8 at% and 16 at% Ag exhibited low resistivity of 96.2 and 38.4 μΩcm after sintering at 180 ℃ in air, respectively.

Keywords:silver-coated copper particles;core-shell;sonochemical reaction;transmetallation;conductive paste

[References]

Pajor-Swierzy A, Farraj Y, Kamyshny A, Magdassi S, Colloids Surf. A: Physicochem. Eng. Asp., 521, 272 (2017)
Kamyshny A, Steinke J, Magdassi S, Open Appl. Phys. J., 4, 19 (2011)
Kim CK, Lee GJ, Lee MK, Rhee CK, Powder Technol., 263, 1 (2014)
Park YS, An CY, Kannan PK, Seo N, Zhuo K, Yoo TK, Chung CH, Appl. Surf. Sci., 389, 865 (2016)
Pajor -Swierzy A, Farraj Y, Kamyshny A, Magdassi S, Colloids Surf. A: Physicochem. Eng. Asp., 522, 320 (2017)
Sim SB, Bae DS, Han JD, Appl. Chem. Eng., 27(1), 68 (2016)
Shin YW, Kim KB, Noh SJ, Soh SY, Appl. Chem. Eng., 29(2), 162 (2018)
Magdassi S, Grouchko M, Kamyshny A, Materials, 3, 4626 (2010)
Nishikawa H, Mikami S, Miyake K, Aoki A, Takemoto T, Mater. Trans., 51, 1785 (2010)
Tsa CH, Chen SY, Song JM, Chen IG, Lee HY, Corrosion Sci., 74, 123 (2013)
Choi EB, Lee JH, Appl. Surf. Sci., 415, 67 (2017)
Choi EB, Lee JB, J. Alloy. Compd., 689, 952 (2016)
Zhang R, Lin W, Lawrence K, Wong CP, Int. J. Adhes. Adhes., 30, 403 (2010)
Hsiao CH, Kung WT, Song JM, Chang JY, Chang TC, Mater. Sci. Eng. A-Struct. Mater. Prop. Microstruct. Process., 684, 500 (2017)
Guo TL, Li JG, Sun X, Sakka Y, Mater. Sci. Eng. C-Biomimetic Supramol. Syst., 61, 97 (2016)
Bang JH, Suslick KS, Adv. Mater., 22(10), 1039 (2010)
Mosleh S, Rahimi MR, Ghaedi M, Dashtian K, Hajati S, Ultrason. Sonochem., 40, 601 (2018)
Heshmat M, Abdizadeh H, Golobostanfard MR, Procedia Mater. Sci., 11, 486 (2015)
Huang B, Hao X, Zhang H, Yang Z, Ma Z, Li H, Nie F, Huang H, Ultrason. Sonochem., 21, 1349 (2014)
Miljevic B, Hedayat F, Stevanovic S, Fairfull-Smith KE, Bottle SE, Ristovski ZD, Aerosol Sci. Technol., 48, 1276 (2014)
Jung HY, Lee SW, Appl. Chem. Eng., 25(1), 84 (2014)
Park HR, Lee SW, Yoo IS, Appl. Chem. Eng., 23(3), 293 (2012)
Tao S, Yang M, Chen HH, Ren MY, Chen GW, J. Colloid Interface Sci., 486, 16 (2017)
Pan L, Li L, Chen Y, Nano Lett., 6(12), 1019 (2011)
Li W, Li L, Gao Y, Hu D, Li CF, Zhang H, Jiu J, Nagao S, Suganuma K, J. Alloy. Compd., 732, 240 (2018)
Ping T, Mihua S, Chengwen S, Shuaihua W, Murong C, Rare Metal Mater. Eng., 45(9), 2214 (2016)
Dehghanpour S, Mahmoudi A, Mirsaeed-Ghazi M, Bazvand N, Shadpour S, Nemati A, Powder Technol., 246, 148 (2013)
Yu X, Li J, Shi T, Cheng C, Liao G, Fan J, Li T, Tang Z, J. Alloy. Compd., 724, 365 (2017)
Hai HT, Takamura H, Koike J, J. Alloy. Compd., 564, 71 (2013)
Muzikansky A, Nanikashvili P, Grinblat J, Zitoun D, J. Phys. Chem. C, 117, 3093 (2013)
Tsai CH, Chen SY, Song JM, Chen IG, Lee HY, Corrosion Sci., 74, 123 (2013)
Chee SS, Lee JH, J. Mater. Chem. C, 2, 5372 (2014)
Grouchko M, Kamyshny A, Magdassi S, J. Mater. Chem., 19, 3057 (2009)
Figueiredo V, Elangovan E, Goncalves G, Barquinha P, Pereira L, Franco N, Alves E, Martins R, Fortunato E, Appl. Surf. Sci., 254(13), 3949 (2008)
Lee CH, Choi EB, Lee JH, Scripta Mater., 150, 7 (2018)
Tseng CC, Hsieh JH, Liu SJ, Wu W, Thin Solid Films, 518(5), 1407 (2009)

[1] Pajor-Swierzy A, Farraj Y, Kamyshny A, Magdassi S, Colloids Surf. A: Physicochem. Eng. Asp., 521, 272 (2017)

[2] Kamyshny A, Steinke J, Magdassi S, Open Appl. Phys. J., 4, 19 (2011)

[3] Kim CK, Lee GJ, Lee MK, Rhee CK, Powder Technol., 263, 1 (2014)

[4] Park YS, An CY, Kannan PK, Seo N, Zhuo K, Yoo TK, Chung CH, Appl. Surf. Sci., 389, 865 (2016)

[5] Pajor -Swierzy A, Farraj Y, Kamyshny A, Magdassi S, Colloids Surf. A: Physicochem. Eng. Asp., 522, 320 (2017)

[6] Sim SB, Bae DS, Han JD, Appl. Chem. Eng., 27(1), 68 (2016)

[7] Shin YW, Kim KB, Noh SJ, Soh SY, Appl. Chem. Eng., 29(2), 162 (2018)

[8] Magdassi S, Grouchko M, Kamyshny A, Materials, 3, 4626 (2010)

[9] Nishikawa H, Mikami S, Miyake K, Aoki A, Takemoto T, Mater. Trans., 51, 1785 (2010)

[10] Tsa CH, Chen SY, Song JM, Chen IG, Lee HY, Corrosion Sci., 74, 123 (2013)

[11] Choi EB, Lee JH, Appl. Surf. Sci., 415, 67 (2017)

[12] Choi EB, Lee JB, J. Alloy. Compd., 689, 952 (2016)

[13] Zhang R, Lin W, Lawrence K, Wong CP, Int. J. Adhes. Adhes., 30, 403 (2010)

[14] Hsiao CH, Kung WT, Song JM, Chang JY, Chang TC, Mater. Sci. Eng. A-Struct. Mater. Prop. Microstruct. Process., 684, 500 (2017)

[15] Guo TL, Li JG, Sun X, Sakka Y, Mater. Sci. Eng. C-Biomimetic Supramol. Syst., 61, 97 (2016)

[16] Bang JH, Suslick KS, Adv. Mater., 22(10), 1039 (2010)

[17] Mosleh S, Rahimi MR, Ghaedi M, Dashtian K, Hajati S, Ultrason. Sonochem., 40, 601 (2018)

[18] Heshmat M, Abdizadeh H, Golobostanfard MR, Procedia Mater. Sci., 11, 486 (2015)

[19] Huang B, Hao X, Zhang H, Yang Z, Ma Z, Li H, Nie F, Huang H, Ultrason. Sonochem., 21, 1349 (2014)

[20] Miljevic B, Hedayat F, Stevanovic S, Fairfull-Smith KE, Bottle SE, Ristovski ZD, Aerosol Sci. Technol., 48, 1276 (2014)

[21] Jung HY, Lee SW, Appl. Chem. Eng., 25(1), 84 (2014)

[22] Park HR, Lee SW, Yoo IS, Appl. Chem. Eng., 23(3), 293 (2012)

[23] Tao S, Yang M, Chen HH, Ren MY, Chen GW, J. Colloid Interface Sci., 486, 16 (2017)

[24] Pan L, Li L, Chen Y, Nano Lett., 6(12), 1019 (2011)

[25] Li W, Li L, Gao Y, Hu D, Li CF, Zhang H, Jiu J, Nagao S, Suganuma K, J. Alloy. Compd., 732, 240 (2018)

[26] Ping T, Mihua S, Chengwen S, Shuaihua W, Murong C, Rare Metal Mater. Eng., 45(9), 2214 (2016)

[27] Dehghanpour S, Mahmoudi A, Mirsaeed-Ghazi M, Bazvand N, Shadpour S, Nemati A, Powder Technol., 246, 148 (2013)

[28] Yu X, Li J, Shi T, Cheng C, Liao G, Fan J, Li T, Tang Z, J. Alloy. Compd., 724, 365 (2017)

[29] Hai HT, Takamura H, Koike J, J. Alloy. Compd., 564, 71 (2013)

[30] Muzikansky A, Nanikashvili P, Grinblat J, Zitoun D, J. Phys. Chem. C, 117, 3093 (2013)

[31] Tsai CH, Chen SY, Song JM, Chen IG, Lee HY, Corrosion Sci., 74, 123 (2013)

[32] Chee SS, Lee JH, J. Mater. Chem. C, 2, 5372 (2014)

[33] Grouchko M, Kamyshny A, Magdassi S, J. Mater. Chem., 19, 3057 (2009)

[34] Figueiredo V, Elangovan E, Goncalves G, Barquinha P, Pereira L, Franco N, Alves E, Martins R, Fortunato E, Appl. Surf. Sci., 254(13), 3949 (2008)

[35] Lee CH, Choi EB, Lee JH, Scripta Mater., 150, 7 (2018)

[36] Tseng CC, Hsieh JH, Liu SJ, Wu W, Thin Solid Films, 518(5), 1407 (2009)