Polyamide-imides (PAIs) are highly desired in many applications because of their superior thermal and mechanical properties. In this work, PAI was prepared from an amide-containing diamine and dianhydride by polycondensation and thermal treatment. Both PAI films and aligned electrospun nanofibers (ANFs) were fabricated. FT-IR was used to determine the structure formation of PAI at different annealing temperatures. DSC and TGA were used to evaluate the thermal properties of PAI, while tensile test was applied to evaluate the mechanical properties of PAI films and ANFs. The results indicated that the PAI possessed both outstanding thermal stability and mechanical properties, which provide opportunities for applications in gas separation, high temperature filtration, reinforcement, etc.