In this study, the ternary Ni - Sn - P alloy coatings were prepared on the copper substrate by electroless deposition at a relatively low temperature of 50 degrees C with a relatively high deposition rate of 9.0 mu m.h(-1) from a neutral solution by using sodium stannate (Na2SnO3) as the fin source. The coating consisted of 96.02% Ni, 2.82% P, and 1.16% Sn. The effects of Na2SnO3 and other deposition parameters on the deposition rate were investigated. Electrochemical experiments were also carried out to reveal the mechanism of Na2SnO3 influencing the Ni - Sn - P deposition procedure. It was found Na(2)SnO(3 )inhibited the anodic oxidation of hypophosphite and accelerated the cathodic reduction of Ni(2+ )simultaneously. Furthermore, the activation energy of Ni - Sn - P deposition process was estimated to be 42.6 kJ.mol (-1). The Ni - Sn - P alloy coating exhibited smoother surface and improved corrosion resistance compared with Ni - P coating.