Tantalum carbide ceramics with an overall composition of TaC0.6 were prepared by hot pressing at 1700 degrees C for 1 h under 30 MPa pressure with fcc TaC and bcc Ta powder as starting materials. Effects of adding 0-30 mol% Cu on densification, phase formation, microstructural evolution, mechanical properties and electrical conductivity of the obtained composite ceramics were investigated. Full density could be reached at 20 mol% Cu addition and above. Reactions between TaC and Ta resulted in the final phases of hexagonal Ta2C and rhombohedral xi-Ta4C3-x. Plate-shaped xi laminate grew in both TaC and Ta2C and consequently had their sizes confined by the parental grains. Addition of 20-30 mol% Cu could significantly grow the intermediate Ta2C grains, hence controlling length of the laminates precipitated in them to form bimodal microstructures consisting of large grains. The 20 mol% Cu composition had a better flexural strength (706 +/- 46 MPa) and fracture toughness (9.2 +/- 1.7 MPa m(1/2)). Electrical resistivity at room temperature of the composites decreased with Cu content from 1.03 mu Omega m at 0 mold/0 addition to 0.12 mu Omega m at 30 mol% Cu.