Polyimides are used in microelectronics as they possess the essential high tensile properties, high thermal stability and low dielectric constant. As the further reduction in their dielectric constant is indispensable for such applications, in this study it was loaded with the porous covalent organic framework (COF-LZU-1) to obtain COF-LZU-1/terpolyimide composites. The composites can capture much air (kappa = 1) in their matrix and bring down the dielectric constant below the virgin polyimides. In the beginning, the terpoly(amic acid)s were prepared, then loaded with the COF-LZU-1, and subsequently, stage cured up to 350 degrees C to obtain COF-LZU-1/terpolyimide composites. Their thermal degradation occurred close to 530 degrees C, illustrating high thermal stability. Their dielectric constant decreased with an increase in the COF-LZU-1 loading from 1 to 4%. The lowest dielectric constant of 1.36 was obtained with 4% loading. So, COF-LZU-1 and different polyimides can be suitably combined to obtain composites with desirable characteristics for applications in microelectronics. POLYM. ENG. SCI., 59:814-820, 2019. (c) 2018 Society of Plastics Engineers