Mechanochemical wear has attracted much attention due to its critical role in micro/nanodevice applications, reliable microscopy, and ultraprecision manufacturing. As a process of stress-associated chemical reactions, mechanochemical wear strongly depends on temperature; however, the impact mechanism is not fully understood at any length scale. Here, we reported different water-temperature dependence of mechanochemical wear on two typical single crystal silicon (Si) surfaces, involving oxide-covered Si partially terminated with Si-OH groups and oxide-free Si fully terminated with Si-H groups. As the water temperature increased from 10 to 80 degrees C, the mechanochemical wear of the oxide-covered Si underwent a process from no obvious surface damage to significant material removal but that occurring at all temperatures decreased gradually on the oxide-free Si surface. The opposite temperature-dependence was found to have a strong relation to the growth or degeneration of the Si-OH surfacial groups. The mechanochemical wear on the both Si surfaces decreased with the Si-OH coverage rising, which facilitated the growth of strongly hydrogen-bonded ordered water and then suppressed the chemical reaction between the sliding interfaces. These results can provide new insight into the mechanism of the surrounding temperature affecting the reliable micro/nanodevices, manufacturing, and microscopy.