We have devised a new method of monitoring using a rotating ring-disk electrode (RRDE) with dissolving disk copper during copper electrodeposition process. The ring current shows linear relationship with SPS concentration from 0 to 3.5 ppm. To minimize the effects of other additives on ring current monitoring, we have conducted cyclic voltammetry stripping (CVS) to estimate the amount of polyethylene glycol (PEG) and sulfonated diallyl dimethyl ammonium chloride copolymer (SDDACC), the leveler. Through silicon via (TSV) fillings have been carried out to check the void free filling of solutions. The electrolyzed solution has been prepared, after 96 hours of electrolysis, voids are formed in electrodeposition of TSV with current density 3 mA/cm(2). After monitoring and adding SPS, PEG and SDDACC, we have achieved a void free filling. Therefore, electrodeposition solution is refreshed even with three organic additives. (C) 2019 The Electrochemical Society.