The aim of this work is to evaluate the effect of different adhesive protocols on the bond strength (SBS) of composite resin for indirect use to repairs of bulk-fill or conventional nanoparticulated composites. Forty-eight cylindrical specimens of composite resin for indirect use were prepared, aged, and randomly divided into four groups (n = 12), a control group without any adhesion protocol, and three experimental groups: Silane + Scotch Bond Multipurpose adhesive (S + SBMP), Tetric N Bond Universal (TBU), and Single Bond Universal (SBU). The treated surfaces were restored using two different composite resins: Filtek Bulk-Fill or Filtek Z350XT. Then, the specimens were submitted to the SBS test, and the resultant data were analyzed with ANOVA on ranks test and Tukey's test (alpha = 0.05). There were no significant differences between the two types of resins used as repair material. For both resins, the groups treated with S + SBMP obtained the highest values (p < 0.001). Groups TBU and SBU did not have statistically significant differences between them. Pre-treatment with a silane coupling agent and a layer of a hydrophobic adhesive can improve the bond strength of repairs performed on a composite resin for indirect use.