Polymer(Korea), Vol.44, No.3, 349-358, May, 2020
폴리에틸렌이민 전처리와 황화구리 무전해 도금에 의한 전기전도성 면섬유의 제조
Preparation of Electroconductive Cotton Fibers by Polyethyleneimine Pretreatment and Electroless Plating of Copper Sulfide
E-mail:
초록
면섬유에 폴리에틸렌이민(PEI)을 처리하여 양이온화시키고, 이를 황산구리와 티오황산나트륨 혼합 용액으로 황화구리 무전해 도금함으로써 전기전도성 면섬유를 제조하였다. PEI 전처리 및 황화구리 도금에 따른 시료들의 표면저항, 마찰대전압, 전자파 차폐효율 변화 등을 분석하였다. 면섬유에 대한 PEI 전처리는 0.5% 이하의 낮은 농도로도 충분하였으며, PEI 전처리된 면직물에 4% 황화구리와 4% 티오황산나트륨 혼합 용액으로 80 °C에서 2시간 동안 황화구리 도금시키면 표면저항이 1~2 Ω/sq 이하인 우수한 전기전도성을 나타내었다. 0.1% PEI 용액으로 전처리한 후 황화구리로 무전해 도금함으로써 0.01 MHz~3 GHz의 주파수 대역에서 35~40 dB의 우수한 전자파 차폐효율을 갖는 전기전도성 면직물을 제조할 수 있었다.
A method of preparing electroconductive cotton fabrics by cationization of cotton fibers with polyethyleneimine (PEI) treatment, followed by electroless plating of copper sulfide with a mixed solution of copper sulfate and sodium thiosulfate was studied. The changes in surface resistance, frictional static voltage, and electromagnetic shielding efficiency of samples according to PEI pretreatment and copper sulfide plating were analyzed. PEI pretreatment on cotton fibers was sufficient at low concentrations below 0.5%. Copper sulfide plating on PEI pretreated cotton fabric with 4% copper sulfate and 4% sodium thiosulfate mixed solution at 80 °C for 2 h showed good surface resistance of 1~2 W/sq or less. By electroless plating with copper sulfide after pretreatment with 0.1% PEI solution, an electrically conductive cotton fabric having an excellent electromagnetic shielding effect of 35~40 dB in the frequency band of 0.01 MHz to 3 GHz could be prepared.
Keywords:electroconductive cotton fiber;electroless plating;copper sulfide;surface resistance;electromagnetic shielding efficiency
- Gu JF, Gorgutsa S, Skorobogatiy M, Smart Mater. Struct., 13, 1 (2010)
- Rossi DD, Santa AD, Mazzoldi A, Mater. Sci. Eng. C-Biomimetic Supramol. Syst., 7, 31 (1999)
- Engin M, Demirel A, Engin EZ, Fedakar M, Measurement, 37, 173 (2005)
- Xueping G, Yating W, Lei L, Bin S, Wenbin H, Surf. Coat. Technol., 201, 7018 (2007)
- Lu Y, Jiang S, Huang Y, Surf. Coat. Technol., 204, 2829 (2010)
- Patankar SN, McAllister SD, Cheng IF, Edwards DB, J. Power Sources, 195(1), 362 (2010)
- Xiang C, Lu W, Zhu Y, Sun Z, Yan Z, Hwang CC, Appl. Mater. Interf., 4, 131 (2012)
- Zhang R, Deng H, Valenca R, Jin J, Fu Q, Bilotti E, Peijs T, Sens. Actuators A-Phys., 179, 83 (2012)
- Wei Q, Xiao X, Hou D, Ye H, Huang F, Surf. Coat. Technol., 202, 2535 (2008)
- Chen CC, Hung CW, Yang SY, Huang CY, J. Appl. Polym. Sci., 109(6), 3679 (2008)
- Mall S, Harder BT, Petrosky JC, Alexander MD, Hansen ND, Polym. Compos., 31, 1343 (2010)
- Roan ML, Chen YH, Liao HH, Huang CY, Chen KN, Yeh JT, Macromol. Symp., 286, 116 (2009)
- Chen YH, Huang CY, Lai FD, Roan ML, Chen KN, Yeh JT, Thin Solid Films, 517(17), 4984 (2009)
- Gao DL, Zhan MS, Appl. Surf. Sci., 255(7), 4185 (2009)
- Gu X, Xue G, Jin S, Li F, Spectrosc. Lett., 30, 139 (1997)
- Baseri S, Zadhoush A, Morshed M, Amirnasr M, Azarnasab M, J. Appl. Polym. Sci., 104(4), 2579 (2007)
- Kang EY, Im SS, Polym. Korea, 10, 354 (1986)
- Kunita MH, Rinaldi AW, Girotto EM, Radovanovic E, Muniz EC, Rubira AF, Appl. Surf. Sci., 252(10), 3707 (2006)
- Cardoso J, GomezDaza O, Ixtlilco L, Nair MTS, Nair PK, Semicond. Sci. Technol., 16, 123 (2001)
- Kunita MH, Girotto EM, Radovanovic E, Goncalves MC, Ferreira OP, Muniz EC, Rubira AF, Appl. Surf. Sci., 202(3-4), 223 (2002)
- Hu H, Gomez-Daza O, Banos L, Sol. Energy Mater. Sol. Cells, 56(1), 57 (1998)
- Kim YW, Oh P, Kim YH, Text. Sci. Eng., 55, 143 (2018)
- Deng SB, Bai RB, Chen JP, J. Colloid Interface Sci., 260(2), 265 (2003)
- Dong Y, Han Z, Liu C, Du F, Sci. Total Environ., 408, 2245 (2010)
- Kislenko VN, Oliynyk, J. Polym. Sci., 40, 914 (2002)
- Maketon W, Ogden KL, Chemoshpere, 75, 206 (2009)
- Lakshmipraba J, Arunachalam S, Gandi DA, Thirunalasundari T, Eur. J. Med. Chem., 46, 3013 (2011)
- Ancutiene I, Janickis V, Ivanauskas R, J. Appl. Polym. Sci., 252, 4218 (2006)
- Trivedy CR, Warnakulasuriya KAAS, Peters TJ, Senkus R, Hazarey VK, Johnson NW, J. Oral Pathol. Med., 29, 241 (2000)
- K. Tappura and S. Nurmi, J. Electrostat., 58, 117 (2003)
- Chubb JN, J. Electrostat., 62, 73 (2004)