The flow distribution and central processing unit (CPU) temperatures inside a rack of thirty 1 U (single rack unit) Sun Fire V20z servers retrofitted with direct-to-chip liquid cooling and two coolant pumping configuration scenarios (central and distributed) are investigated using the EPANET open source network flow software. The results revealed that the servers in the top of the rack and close to the cooling distribution unit can receive up 30% higher flow rate than the servers in the bottom of the rack, depending on the pumping scenario. This results in a variation in the CPU temperatures depending on the position in the rack. Optimization analysis is carried out and shows that increasing the flow distribution manifold's dimensions can reduce the flow variation through the servers and increase the total coolant flow rate in the rack by roughly 10%. In addition, activating the small pumps in the direct-to-chip liquid cooling loops inside the servers (distributed pumping) resulted in an increase of 2 degrees C in the CPU temperatures at the high computational workload.