화학공학소재연구정보센터
홈 로그인 로그아웃 연락처 사이트맵
Macromolecular Research, Vol.28, No.10, 960-967, September, 2020
DOI10.1007/s13233-020-8127-8  Export Citation
Curing Behavior of 4,4′-Diglycidyloxybiphenyl with p-Phenylene Diamine Derivatives
Arinola Isa Olamilekan1, and Hyeonuk Yeo1, 2, †
  • 1Department of Science Education, Kyungpook National University, Daegu 41566, Korea
  • 2Department of Chemistry Education, Kyungpook National University, Daegu 41566, Korea
E-mail:
To expand the applicability of 4,4′-diglycidyloxybiphenyl (BP), the simplest liquid crystalline epoxy derivative, the curing reaction mechanism with p-phenylenediamine (p-PDA) derivatives under various stereoscopic conditions was investigated through kinetic analyses. Specifically, curing factors such as the starting temperature, heat, and activation energy were studied and analyzed. In particular, the effect of steric hindrance of the hardeners on the mechanism of curing reactions was explored by analyzing isothermal kinetics. It was found that the larger steric hindrance of the curing agents induced the slower curing reaction, and the contribution of the reduction in the self-catalytic curing was more pronounced than the SN2 reaction. To determine the optimized curing conditions, cured BP materials were fabricated and their glass-transition temperatures and thermal conductivities, which significantly improved over general-purpose epoxy resins owing to the characteristics of the liquid crystal, were investigated.
Keywords:epoxy;curing;kinetics;thermosets;thermal conductivity
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