We describe a simple way of producing adherent metal films (Cu or Ni) on insulator surfaces [SiO2, glass, or polyphenylquinoxaline (PPQ), an insulating polymer] by electroless growth on a thermally activated palladium acetylacetonate [Pd(acac)(2)] seeding layer. Using this process, we produced tiny metal patterns on insulators by localized laser pyrolysis (using either a pulsed Cu vapor or a cw Ar+ laser) of the spun-on seeding layer. A tensile stress test applied to a Ni deposit on SiO2 reveals bonding strengths as high as 2 N/mm(2). The mechanisms of such an increased adherence have been studied using x-ray photoemission spectroscopy (XPS). The critical role of the chemical environment of the Pd clusters obtained by pyrolytic decomposition of the Pd(acac)(2) seeding layer is shown. In particular, XPS reveals that most of the Pd atoms left at the surface after thermal decomposition still remain bonded to an organic aromatic species identified as one of the two acetylacetonate "wings" of the parent molecule. A wear-resistant metal deposit on insulators can only be formed when these remaining ligands are removed by an additional acetic acid treatment.