화학공학소재연구정보센터
Journal of Vacuum Science & Technology A, Vol.15, No.6, 2915-2922, 1997
Interaction Between Water and Fluorine-Doped Silicon-Oxide Films Deposited by Plasma-Enhanced Chemical-Vapor-Deposition
The interaction between water and fluorine-doped silicon oxide (SiOF) films has been studied using Fourier transform infrared spectroscopy and thermal desorption spectroscopy. The effects of the interaction on the relative dielectric constant of films were also studied using capacitance-voltage measurements. It was found that SiOF films with high fluorine concentration have three absorption bands attributable to Si-Fn stretching vibration, however, the SiOF films have only one absorption band after humidification. The residual band is assumed to be attributable to silicon monofluoride [Si(O-)(3)F] sites and the disappearing bands are attributable to silicon difluoride [Si(O-)(2)F-2] sites. Si(O-)(2)F-2 sites are hydrided during humidification and generate Si-OH bonds and HF in the film. In addition, Si(O-)(2)F-2 sites increase the water absorbed in film. The relative dielectric constant of SiOF films capped by silicon nitride decreased steadily with increased fluorine concentration, from 4.5 (SiO2) to less than 2.8 [11.5 at. % (F)], however, that of uncapped SiOF films saturated the decrease at about 3.6 in films having 7.6 at. % (F) or more. This saturation is caused by the increase of Si(O-)(2)F-2 sites in film because the ratio of Si(O-)(2)F-2 sites to total fluorine bonding sites increases markedly at a fluorine concentration above 7.6 at. % (F). Si(O-)(2)F-2 sites increase Si-OH bonds and water absorbed in film, and both, in turn, increase the film dielectric constant.