Crystallinity-tailorable solvent-free hybrid adhesive films composed of epoxy, diacid, and poly(ethylene glycol) with curable and deoxidizing capabilities

Bo-Young Lee; Keon-Soo Jang

Journal of Industrial and Engineering Chemistry, Vol.100, 186-193, August, 2021

DOI10.1016/j.jiec.2021.05.024 Export Citation

Crystallinity-tailorable solvent-free hybrid adhesive films composed of epoxy, diacid, and poly(ethylene glycol) with curable and deoxidizing capabilities

Bo-Young Lee, and Keon-Soo Jang^†

Department of Polymer Engineering, School of Chemical and Materials Engineering, The University of Suwon, Hwaseong, Gyeonggi-do, 18323, Republic of Korea

E-mail:

The technology of curable adhesive films capable of deoxidization is still in its infancy. Herein, an ecofriendly solution lies in utilizing an epoxy binder, a diacid, and a thermoplastic matrix with low transition temperature, namely, poly(ethylene glycol) (PEG). We fabricated a specially designed hybrid adhesive film with curable and deoxidizing capabilities by harnessing and controlling acidic moieties. The deoxidizing capability of the films and the crystallinity of PEG in the cured films were further controlled by the combination of acidic concentrations and reaction times. Acidic concentrations higher than the stoichiometric ratio (1:1) between the epoxy binder and pimelic acid considerably hindered the PEG crystallinity in the cured films. This suppressed crystallinity was observed based on DSC, POM, XRD, and FTIR results. The rheological and mechanical properties were systematically examined. The fabricated hybrid adhesive films with curable deoxidizing capabilities can be useful in a myriad of applications, such as electronics and semiconductor packaging that require soldering.

Keywords:Poly(ethylene glycol);Epoxy;Adhesive film;Tailored crystallinity;Deoxidizing

[References]

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[1] Kamar NT, Drzal LT, Lee A, Askeland P, Polymer, 111, 36 (2017)

[2] Quan D, Deegan B, Alderliesten R, Dransfeld C, Murphy N, Ivankovic A, Benedictus R, Mater. Des., 192, 108781 (2020)

[3] Han S, Meng Q, Qiu Z, Osman A, Cai R, Yu Y, Liu T, Araby S, Polymer, 184, 121884 (2019)

[4] Tian Y, Wang Q, Shen L, Cui Z, Kou L, Cheng J, Zhang J, Chem. Eng. J., 383, 123124 (2020)

[5] Yang J, He X, Wang H, Liu X, Lin P, Yang S, Fu S, J. Appl. Polym. Sci., 137(17), 48596 (2020)

[6] Zhang Y, Hasegawa K, Kamo S, Takagi K, Ma W, Takahara A, ACS Appl. Polym. Mater., 2(4), 1500 (2020)

[7] Jang KS, Eom YS, Choi KS, Bae HC, J. Appl. Polym. Sci., 135(33), 46639 (2018)

[8] Jang KS, Eom YS, Choi KS, Bae HC, Ind. Eng. Chem. Res., 57(21), 7181 (2018)

[9] Savvilotidou M, Vassilopoulos AP, Frigione M, Keller T, Constr. Build. Mater., 140, 552 (2017)

[10] Back JH, Baek D, Shin JH, Jang SW, Kim HJ, Kim JH, Song HK, Hwang JW, Yoo MJ, Polymers, 11(1), 152 (2019)

[11] Chen C, Xue Y, Li X, Wen Y, Liu J, Xue Z, Shi D, Zhou X, Xie X, Mai YW, Compos. Part Appl. Sci. Manuf., 118, 67 (2019)

[12] Jang KS, Eom YS, Choi KS, Bae HC, Polym. Int., 67(9), 1241 (2018)

[13] Xiong B, Zhong W, Zhu Q, Liu K, Li M, Sun G, Wang D, Nanoscale, 9(48), 19216 (2017)

[14] Lee S, Yoo T, Han Y, Kim H, Han H, J. Electron. Mater., 46(8), 4740 (2017)

[15] Zhang F, Li M, Chen WT, Chian KS, IEEE Trans. Compon. Packag. Technol., 26(1), 233 (2003)

[16] Li G, He YC, Zhu PL, Zhao T, Sun R, Lu D, Wong CP, Polymer, 156, 111 (2018)

[17] Tuan CC, James NP, Lin Z, Chen Y, Liu Y, Moon KS, Li Z, Wong CP, ACS Appl. Mater. Interfaces, 9(10), 8437 (2017)

[18] Bawendi MG, Freed KF, J. Chem. Phys., 88(4), 2741 (1988)

[19] Garcia IL, Keddie JL, Sferrazza M, Surf. Interface Anal., 43(11), 1448 (2011)

[20] Dario AF, Macia HB, Petri DFS, Thin Solid Films, 524, 185 (2012)

[21] Eom YS, Jang K, Moon JT, Nam JD, Kim JM, Microelectron. Eng., 85(11), 2202 (2008)

[22] Baek JW, Jang KS, Eom YS, Moon JT, Kim JM, Nam JD, Microelectron. Eng., 87(10), 1968 (2010)

[23] He Y, Moreira BE, Overson A, Nakamura SH, Bider C, Briscoe JF, Thermochim. Acta, 357-358, 1 (2000)

[24] Lee BY, Lee DH, Jang KS, Polymers, 13(7), 1129 (2021)

[25] Ono K, Tanaike O, Ishii R, Nakamura T, Shikinaka K, Ebina T, Nge TT, Yamada T, ACS Omega, 4(17), 17251 (2019)

[26] Jiang J, Lee JE, Kim KS, Suganuma K, J. Alloy. Compd., 462(1), 244 (2008)

[27] Sangaletti L, Depero LE, Allieri B, Pioselli F, Comini E, Sberveglieri G, Zocchi M, J. Mater. Res., 13(9), 2457 (1998)

[28] Jang KS, Korley LTJ, Polym. Eng. Sci., 56(4), 388 (2016)

[29] Jang KS, Johnson JC, Hegmann T, Hegmann E, Korley LTJ, Liq. Cryst., 41(10), 1473 (2014)

[30] Lloyd GR, Craig DQM, Smith A, J. Pharm. Sci., 86(9), 991 (1997)

[31] Capanema NSV, Mansur AAP, de Jesus AC, Carvalho SM, de Oliveira LC, Mansur HS, Int. J. Biol. Macromol., 106, 1218 (2018)

[32] Sionkowska A, Polym. Degrad. Stabil., 91(2), 305 (2006)

[33] Covaliu CI, Jitaru I, Paraschiv G, Vasile E, Biris SS, Diamandescu L, Ionita V, Iovu H, Powder Technol., 237, 415 (2013)

[34] Cole KS, Cole RH, J. Chem. Phys., 9(4), 341 (1941)

[35] Jang KS, Polymer, 147, 133 (2018)