Journal of Vacuum Science & Technology A, Vol.17, No.5, 2859-2868, 1999
Establishing the relationship between process, structure, and properties on titanium nitride films deposited by electron cyclotron resonance assisted reactive sputtering. II. A process model
Research has been conducted to investigate ways to make thinner, yet more cohesive TIN films. Physical Vapor deposition techniques were used in conjunction with electron cyclotron resonance to deposit TiN films on substrates of Inconel 718. This investigation has focused on the relationship between him deposition parameter interactions, and the resulting film microstructure and mechanical response. Previous parts of this investigation have quantified the differences in Meyer hardness and grain orientation of these deposited TiN films as a function of systematically varied deposition conditions. This part of the research develops a model that explores the connection between deposition conditions, him texture, and mechanical integrity. This model describes the relationship between the triad of (1) deposition conditions, (2) texture metrics that include fractal exponent, crystal orientation, and grain size, and (3) mechanical response, as measured-by Meyer hardness and root-mean-square roughness.
Keywords:CHEMICAL-VAPOR-DEPOSITION;INTERNAL-STRESSES;CRYSTAL-STRUCTURE;DC MAGNETRON;COATINGS;TIN;MORPHOLOGY;TOPOGRAPHY;DIFFUSION;SURFACES